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PV04100 - SEMI PV41 - Test Method for In-Line, Noncontact Measurement of Thickness and Thickness Variation of Silicon Wafers for PV Applications Using Capacitive Probes StdPbc-0724 Where feasible

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Description

Where feasible

2  All metrics defined herein are applicable to equipment systems that include subsystems

which are intended to provide wafers avoiding the difficulties enumerated above

SEMI E36 — Semiconductor Equipment Manufacturing Information Tagging Specification

PV04100 - SEMI PV41 - Test Method for In-Line, Noncontact Measurement of Thickness and Thickness Variation of Silicon Wafers for PV Applications Using Capacitive Probes StdPbc-0724 Where feasibleWafer thickness and its variation across a wafer are important parameters for solar cell manufacturing. Excessive thickness variations within a lot from wafer to wafer or within a wafer may negatively impact process yield and solar cell efficiency. Both parameters are part of the specification for solar cell wafers (SEMI PV22), which define a thickness range as well as an upper limit for the total thickness variation (TTV). In addition, careful

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